IC module and a data carrier employing the same

ABSTRACT

A block-shaped IC module (1) seals an IC chip (30) by an insulator and comprises contact terminals (101 to 106; 111 to 116) and retaining means (14, 15), wherein the contact terminals (101 to 106; 111 to 116) extend from an upper surface to side surfaces of the IC module (1) and they are electrically connected to the IC chip (30) so as to send data to or receive data from the IC chip (30). A data carrier (100, 120, 140, 160) on which the IC module (1) is fitted includes a hole portion (41, 91) having holding members (42, 43; 71, 72; 92, 93) corresponding to the retaining means (14, 15) so as to be engaged with the IC module (1). Accordingly, one IC module (1) can be freely used for various data carriers. Further, the IC module (1) can be thickened as much as possible, thereby improving strength of the IC module (1).

TECHNICAL FIELD

The present invention relates to an IC module having a microcomputertherein which is used by various data carriers such as an integratedcircuit (hereinafter referred to as an IC) card with contacts, acontactless IC card, an IC coin and an IC memory card, and a datacarrier on which the IC module is fitted.

BACKGROUND TECHNOLOGY

A prior art IC module and a prior art data carrier are disclosed in thefollowing literature.

Literature: Japanese Patent Laid-Open Publication No. 58-138057

The IC module which is disclosed on this literature has a printedcircuit board. A wiring pattern is formed in a rear surface of theprinted circuit board and a contact terminal pattern is formed on anupper surface of the printed circuit board. The wiring pattern andcontact terminal pattern are electrically connected to each other by wayof a through hole portion. Further, an IC chip is disposed on the rearsurface of the printed circuit board. This IC chip incorporates thereina microcomputer provided with a central processing unit (hereinafterreferred to CPU) and a memory wherein a terminal pad formed on the ICchip is connected to the wiring pattern by a wire. These IC chip, wire,etc. are molded out of a resin member so as to form a chip on board(hereinafter referred to as COB) structure.

An IC card as a data carrier employing this IC module consists of a cardsubstrate which is made of vinyl chloride, etc. and formed in a cardshape and a spot facing on which the IC module is fitted is provided onthe card substrate. The IC card can be manufactured by inserting the ICmodule into the spot facing and fixing the IC module on the spot facingby an adhesive agent.

If such IC card is inserted into a card reader/writer, signals are sentor received between the card reader/writer and the IC chip through thecontact terminal pattern. As a result, a data processing is performed bythe IC chip.

There are prepared recently various data carriers for the IC module suchas an IC card with contacts, a contactless IC card, an IC coin and an ICmemory card. It has been desired for these various data carriers to usethe same data of the IC module mutually. It has been also desired toimprove strength of the IC module as the data carriers are thinned.

It is an object of the invention to provide an IC module which can beused mutually by various data carriers.

It is another object of the invention to provide an IC module which isimproved in its strength.

It is still another object of the invention to provide a data carrieradapted for using the IC module of this invention.

DISCLOSURE OF THE INVENTION

To achieve the above object, the IC module which is fitted on a datacarrier and made of an insulating member for sending and receiving datacomprises an IC chip including a data processor such as a centralprocessing unit and a terminal through which data is sent to or receivedfrom the data processor, an insulator for sealing the IC chip and havinga given block-shape, contact terminals which extend from an uppersurface of the insulator to confronted side surfaces of the same andwhich are electrically connected to the terminal of the IC chip, andretaining means which are formed on another confronted side surfaces ofthe insulator and are detachably engaged with the data carrier.

The data carrier on which the IC module is fitted comprises a substratewhich consists of an insulating member and has thickness whichcorresponds to that of the IC module and dimensions which are greaterthan those of the IC module, a hole portion which is provided on thesubstrate and has such dimensions that the IC module can be engagedtherein, and holding means which are disposed on inner side surfaces ofthe hole portion so as to hold the retaining means of the IC module.

With such an arrangement, it is possible to realize the provision of theIC module which can be used mutually by various data carriers and whichis improved in its strength and the data carrier adapted for using theIC module of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of an IC module showing an embodiment ofthe present invention;

FIG. 2 is a cross-sectional view taken along A-A' of FIG. 1;

FIG. 3 is a schematic functional block diagram showing a relationshipbeen an IC chip and each contact terminal in the IC module of FIG. 1;

FIG. 4 is a perspective view of an IC card with contacts as a datacarrier which is adapted for using the IC module of FIG. 1;

FIG. 5 is a perspective view of a contactless IC card as a data carrierwhich is adapted for using the IC module of FIG. 1;

FIG. 6 is a perspective view of an anisotropic conductive film;

FIG. 7 is a cross-sectional view taken along B-B' of FIG. 6;

FIG. 8 is view showing a state where the conductive film of FIG. 6 isfitted on the IC module of FIG. 1;

FIG. 9 is a view showing a state of use of the IC module wherein theconductive film of FIG. 8 is fitted on the contactless IC card of FIG.5;

FIG. 10 is a perspective view of an IC memory card as a data carrierwhich is adapted for using the IC module of FIG. 1;

FIG. 11 is a cross-sectional view taken along C-C' of FIG. 10;

FIG. 12 is a perspective view of an IC coin as a data carrier which isadapted for using the IC module of FIG. 1; and

FIG. 13 is a view of another conductive pattern provided in a holeportion of a data carrier such as the contactless IC card.

BEST MODE FOR CARRYING OUT THE INVENTION

The present invention will be now described in detail with reference todrawings. FIG. 1 is a perspective view of an IC module according to anembodiment of the present invention.

The IC module shown in FIG. 1 is used e.g. by an IC card which is one ofdata carriers. This IC module 1 consists of a substantially rectangularparallelepiped insulator 10 having a thickness as an IC card (e.g., 0.76mm) which is prescribed by a standard of an international organizationfor standardization (hereinafter referred to as ISO). Six surfacecontact terminals 101 to 106 are formed on an upper surface of theinsulator 10. These six surface contact terminals 101 to 106 areelectrically connected to six side surface contact terminals 111 to 116which are formed on confronted side surfaces of the insulator 10.Further, a convex portion 14 and a concave portion 15 are formed on theother confronted side surfaces of the insulator 10. The convex portion14 and concave portion 15 are used as retaining means for detachablyengaging with a card substrate, described later.

A cross-sectional view of the IC module 1 taken along A-A' of FIG. 1 isshown in FIG. 2. In FIG. 2, an IC chip 30 is incorporated in theinsulator 10. The insulator 10 comprises a printed circuit board 11 madeof glass, epoxy resin, etc. for forming the upper surface thereof, aframe member 12 made of rigid polyvinyl chloride, etc. for forming bothside surfaces and a resin member 13 made of epoxy resins, etc. forforming a rear surfaces. The printed circuit board 11 has a plurality ofsurface contact terminals 101 to 106 on its upper surface and a wiringpattern 22 on its rear surface. A plurality of side surface contactterminals 111 to 116, which are extended from a plurality of surfacecontact terminals 101 to 106, are formed on the frame member 12 formingthe confronted side surfaces of the insulator. There are formed on theprinted circuit board 11 conductive through hole portions 23 throughwhich the surface contact terminals 101 to 106, side surface contactterminals 111 to 116 and the wiring pattern 22 are electricallyconnected to one another. The IC chip 30 is fixed to the rear surface ofthe printed circuit board 11, and a terminal pad 35 and the wiringpattern 22 respectively formed on the IC chip 30 are electricallyconnected to each other by way of a wire 36. An inside of the framemember 12 is molded out of the resin member 13 so as to cover the ICchip 30, wire 36, etc.

The relationship between the IC chip 30 and each of the surface contactterminals 101 to 106 and 111 to 116 is explained with reference todrawings. FIG. 3 is a schematic functional block diagram showing therelationship between the IC chip 30 and each of the surface contactterminals 101 to 106 and 111 to 116 as shown in FIG. 1.

The IC chip 30 includes, for example, a CPU consisting of a controlportion 31 and an arithmetic portion 32, a program memory 33 for storinga program therein, and a data memory 34 for storing data therein. Theterminal pad 35 is connected to the control portion 31 and it iselectrically connected to the surface contact terminals 101 to 106 and111 to 116 by way of the wire 36, wiring pattern 22 and the through holeportions 23 as shown in FIG. 2.

In such IC chip 30, data is input to the control portion 31 from thesurface contact terminals 101 to 106 or contact terminals 111 to 116 byway of the terminal pad 35. The control portion 31 permits thearithmetic portion 32 to perform an arithmetic operation in accordancewith the program which is stored in the program memory 33. A dataprocessing is performed by storing the result of arithmetic operation inthe data memory 34, at need.

FIG. 4 is a perspective view of an IC card with contacts 100 to whichthe IC module 1 shown in FIG. 1 can be applied.

The IC card 100 consists of a card substrate 40 which is formed of rigidpolyvinyl chloride, etc. and has given dimensions. The dimensions of theIC card 100 are, e.g., 86 mm×54 mm×0.76 mm in accordance with thestandard of the ISO. A hole portion 41 is formed on the card substrate40 at a given position so that the IC module 1 of FIG. 1 is fitted intothe hole portion 41. There are formed on confronted inner side surfacesof the hole portion 41, holding means, e.g., a concave portion 42 and aconvex portion 43 for detachably engaging with the convex portion 14 andconcave portion 15 of the IC module 1. The concave portion 42 is engagedwith the convex portion 14 while the convex portion 43 is engaged in theconcave portion 15. As a result, the IC module 1 can be detachablyengaged in the hole portion 41 of the card substrate 40.

An operation of the IC card 100 employing the IC module 1 having theaforementioned structure will be next described.

For example, if the IC card 100 is inserted into a card reader/writer atthe state where the IC module 1 of FIG. 1 is engaged in the hole portion41 of the card substrate 40 of the IC card with contacts 100 of FIG. 4,the surface contact terminals 101 to 106 of the IC module 1 of FIG. 1which is fitted on the IC card 100, are electrically connected toterminals of the card reader/writer. When data is input into the surfacecontact terminals 101 to 106 of the IC module 1 by way of the terminalsof the card reader/writer, the control portion 31 inside the IC chip 30permits the arithmetic portion 32 to perform an arithmetic operationbased on the input data in accordance with the program which is storedin the program memory 33. A result of arithmetic operation is output tothe card reader/writer by way of the surface contact terminals 101 to106 of the IC module 1.

The IC module 1 and the IC card 100 employing the IC module 1 accordingto the present invention have the following effects.

(1) The convex portion 14 and concave portion 15 are provided at theside surfaces of the IC module 1 and the concave portion 42 and convexportion 43 are provided on inner side surfaces of the hole portion 41 ofthe card substrate 40 for engaging with the convex portion 14 andconcave portion 15, thereby providing an engaging structure not anadhesive structure. Since the IC module 1 is used while it is engagedinto the hole portion 41 of the card substrate 40, it does not form adedicated part of a piece of specific IC card with contacts 100 but itcan be used for a plurality of IC cards by being replaced with another.

(2) Since the IC module 1 is used while it is engaged in the holeportion 41 of the card substrate 40, the thickness of the IC module 1can be made the same as the maximum thickness of the card substratewhich is allowable by a standard (e.g., 0 76 mm in the standard of theISO). Accordingly, strength of the IC module 1 can be improved.

A perspective view of a contactless IC card to which the IC module 1 ofFIG. 1 can be applied is shown in FIG. 5. Elements which are common tothose in FIGS. 1 to 3 are denoted at the same numerals.

A contactless IC card 120 consists of the card substrate 40 having givendimensions (e.g., 86 mm×54 mm×0.76 mm in case of the ISO standard) onwhich the hole portion 41 is formed like that of FIG. 4.

An electronic circuit is provided in the card substrate 40 and itcomprises, for example, coils 44 and 45 and an interface IC 46 connectedto these coils 44 and 45. Further, conductive pattern portions 51 to 56are formed on inner side surfaces of the hole portion 41 for contactingthe contact terminals 111 to 116 of the IC module 1 of FIG. 1. Theconductive pattern portions 51 to 56 are connected to conductivepatterns 50 which are drawn or extended from terminals of an interfaceIC 46. The concave portion 42 and convex portion 43 for detachablyengaging with the convex portion 14 and concave portion 15 of the ICmodule 1 of FIG. 1 are formed on the inner side surfaces of the holeportion 41. The coils 44 and 45 receive a power energy by way of aninterface device as an external device, not shown, due toelectromagnetic induction produced therein, or send data or receive databetween themselves and this interface device. The interface IC 46connected to the coils 44 and 45 has function to smooth electromagneticenergy from the coils 44 and 45 or shape signals which are sent orreceived therethrough or to send data or receive data between the ICchip 30 and the interface device, when connected to the IC chip 30.

It is preferable to use, for example, an anisotropic conductive film 200of FIG. 6 so that the contactless IC card 120 of FIG. 5 to suitablyemploy the IC module 1 of FIG. 1.

The anisotropic conductive film 200 consists of an elastic orstretchable annular insulating tape 201. A plurality of conductive parts202 are scattered in the anisotropic conductive film 200. A scatteringstate of the conductive parts 202 will be now described with referenceto FIG. 7.

FIG. 7 is a cross-sectional view taken along B-B' of FIG. 6. As shown inFIG. 7, the conductive parts 202 extend in the direction of a filmthickness of the insulating tape 201 and they are arranged with thespace of about 10 μm. Each of the conductive parts 202 is provided inthe anisotropic conductive film 200 so as to penetrate the anisotropicconductive film 200, i.e. extend from the upper surface to the rearsurface of the anisotropic conductive film 200. The anisotropicconductive film 200 has hole portions 208 and 204 at positionscorresponding to the convex portion 14 and concave portion 15 of the ICmodule 1. The anisotropic conductive film 200 has a tapered portion at alower end thereof. When the anisotropic conductive film 200 is fitted onthe IC module 1, it is positioned near the rear surface of the ICmodule 1. As a result, when the IC module 1 is engaged in the holeportion 41 of the data carrier, the anisotropic conductive film 200fitted on the IC module 1 is prevented from being come off and it iseasily interposed between the IC module 1 and the data carrier.

A state where the anisotropic conductive film 200 is fitted on the ICmodule 1 of FIG. 1 is shown in FIG. 8.

In FIG. 8, the hole portions 203 and 204 of the anisotropic conductivefilm 200 are positioned to correspond to the convex portion 14 andconcave portion 15 of the IC module 1. The contact terminals 111 to 116of the IC module 1 are electrically connectable to an external interfacedevice by way of the conductive parts 202.

A state where the IC module 1 of FIG. 8 is fitted on the card substrate40 of the contactless IC card 120 of FIG. 5 is shown in FIG. 9. In FIG.9, the surface contact terminals of the IC module 1, e.g. the surfacecontact terminals 101 to 103 are electrically connected to theconductive pattern portions 51 to 53 provided on the card substrate 40by way of the contact terminals 111 to 113 and a plurality of conductiveparts 202 of the anisotropic conductive film 200. At this time, since aplurality of conductive parts 202 are electrically independent of eachother by the insulating tape 201, the conductive pattern portions 51 to53 are not electrically short circuited by the anisotropic conductivefilm 200. The convex portion 43 and concave portion 42 (not shown inFIG. 9) of the card substrate 40 are engaged in the concave portion 15and convex portion 14 (not shown in FIG. 9) of the IC module 1 so as tofix the IC module 1 to the hole portion 41 of the card substrate 40.However, since the dimensions of the IC module 1 are slightly smallerthan those of the hole portion 41 of the card substrate 40, the formerhas weak adhesion to the latter.

However, since the anisotropic conductive film 200 is interposed betweenthe IC module 1 and card substrate 40, the adhesion of the IC module 1to the card substrate 40 is improved.

When the thus assembled contactless IC card 120 is inserted into theinterface device, electric energy is supplied from the interface deviceto the contactless IC card 120 due to electromagnetic induction producedin the coils 44 and 45. The electromagnetic energy supplied to thecontactless IC card 120 is smoothed by the interface IC 46 and then itis supplied to the IC chip 30 in the IC module 1 by way of theconductive pattern 50, conductive pattern portions 51 to 56, anisotropicconductive film 200 and contact terminals 111 to 116 of the IC module 1.The IC chip 30 is driven upon reception of the electromagnetic energy.When a signal is supplied from the interface device to the contactlessIC card 120, the same signal is supplied to the interface IC 46 by wayof the coils 44 and 45 due to electromagnetic induction produced in thecoils 44 and 45. The interface IC 46 shapes the signal supplied from theinterface device and supplies the shaped signal to the IC chip 30 in theIC module 1 by way of the conductive pattern 50, conductive patternportions 51 to 56, anisotropic conductive film 200 and the contactterminals 111 to 116 of the IC module 1. The IC chip 30 permits thearithmetic portion 32 to perform arithmetic operation in accordance withthe program which is stored in the program memory 33 in response to thesignal, e.g., supplied from the interface IC 46. A result of arithmeticoperation is stored in the data memory 34. The result of arithmeticoperation which is stored in the data memory 34 is supplied to theinterface device due to electromagnetic inductance by way of the contactterminals 111 to 116, anisotropic conductive film 200, conductivepattern portions 51 to 56, conductive pattern 50, interface IC 46 andthe coils 44 and 45.

Accordingly, even if the surface contact terminals 101 to 106 of the ICmodule 1 engaged with the card substrate 40 are not directly connectedto the interface device, the data can be sent and received between theIC chip 30 and the interface device due to electromagnetic inductanceproduced in the coils 44 and 45.

As mentioned above, the IC module 1 and contactless IC card 120employing the IC module 1 have the following effects.

(1) The interface IC 46 and the IC chip 30 in the IC module 1 areelectrically connected to each other by providing the conductive patternportions 51 to 56, which are extended from the conductive pattern 50, onthe inner side surfaces of the hole portion 41 formed on the cardsubstrate 40, and permitting the conductive pattern portions 51 to 56 tocontact the contact terminals 111 to 116 of the IC module 1.Accordingly, it is possible to mount the IC module 1 not only on the ICcard with contacts having no existing electronic circuit in the cardsubstrate 40 as shown in FIG. 4 but also on the contactless IC cardhaving the existing electronic circuit such as the interface IC 46 inthe card substrate 40 as shown in FIG. 5.

(2) It is possible to use the IC module 1 for a plurality of IC cardslike the IC card with contacts by replacing it with another. Further,since the thickness of the IC module 1 can be made the same as themaximum thickness of the card substrate 40 which is allowable by thestandard, strength of the IC module 1 can be improved.

(3) When the contactless IC card 120 and IC module 1 are electricallyconnected to each other by the anisotropic conductive film 200, datatransfer can be assured and adhesion between the contactless IC card 120and IC module 1 can be improved.

A perspective view of an IC memory card to which the IC module 1 of FIG.1 can be applied is shown in FIG. 10. FIG. 11 is a cross-sectional viewtaken along C-C' of FIG. 10.

An IC memory card 140 has various dimensions. Typical dimensions are 86mm×54 mm×3.3 mm in accordance with a standard of the Japan ElectronicIndustry Development Association (JEIDA) if the card is mainly intendedto be used as, e.g., an auxiliary memory of a personal computer. The ICmemory card 140 meeting the standard of the JEIDA comprises a covermember 60 having dimensions of 86 mm×54 mm×3.3 mm and a connector 61which is attached to one side surface of the cover member 60. A printedcircuit board 62 is provided in the cover member 60 and there areprovided on the printed circuit board an IC memory chip 63 for storingtherein a plurality of data and an interface circuit 64 such as adedicated gate array for performing an interface control between it anda bus of a personal computer, wherein the IC memory chip 63 andinterface circuit 64 are connected to the connector 61.

When the IC memory card 140 meeting the standard of the JEIDA isinserted into an I/O portion of the personal computer, the interfacecircuit 64 is connected to the bus in the personal computer by way ofthe connector 61. As a result, an interface control between the bus inthe personal computer and the IC memory chip 63 is performed by way ofthe interface circuit 64. Accordingly, it is possible to use the ICmemory card 140 as an auxiliary memory of the personal computer.

The IC memory card 140 of this type meeting the standard of the JEIDA ismainly intended to be used as an auxiliary memory of a personalcomputer. However, with the spread of an IC card or an IC memory card,it is desired to check an access right to the personal computer byconnecting the IC card to the personal computer without interposing acard reader/writer therebetween or letting the IC memory card have an IDfunction (function to identify a user) of the IC card. Accordingly, anIC memory card is desired to partake of the IC card.

Accordingly, as shown in FIG. 10, a hole portion 71 in which the ICmodule 1 of FIG. 1 is engaged is formed on the IC memory card 140 havingthe conventional dimensions (e.g., 86 mm×54 mm×3.3 mm in case of thestandard of the JEIDA). There are formed on inner side surfaces of thehole portion 71 a concave portion 72 with which the convex portion 14 ofthe IC module 1 of FIG. 1 is engaged and a convex portion 73 with whichthe concave portion 15 of the IC module 1 of FIG. 1 is engaged. Further,conductive patterns on the printed circuit board 62 are extended to theinner side surfaces of the hole portion 71 to form conductive patternportions 81 to 86 so as to correspond to the surface contact terminals101 to 106 of the IC module 1 of FIG. 1.

The thickness of the IC module 1 of FIG. 1 is preferable to be the sameas that of the IC card of FIG. 4 or 5. Alternatively, the thickness ofthe IC module 1 may be the same as that of the IC memory card 140 ofFIG. 10.

When the IC module 1 of FIG. 1 is engaged in the hole portion 71 of theIC memory card 140 having the aforementioned structure, the convexportion 14 of the IC module 1 is engaged in the concave portion 72 ofthe hole portion 71 while the concave portion 15 of the IC module 1 isengaged with the convex portion 73 of the hole portion 71, which resultsin fitting of the IC module 1 on the IC memory card 140. Accordingly,the contact terminals 111 to 116 of the IC module 1 and the conductivepatterns 81 to 86 of the hole portion 71 contact one another so that theIC module 1 is connected to the IC memory chip 63, interface circuit 64and the connector 61.

When the thus assembled IC memory card 140 is inserted into, e.g., anI/O portion of a personal computer, data can be sent or received betweenan internal bus of the personal computer and the IC module 1 by way ofthe interface circuit 64. Accordingly, the IC memory card 140 can beoperated as an IC memory card which partakes both of the IC card and ICmemory card.

The IC module 1 and IC memory card 140 employing the IC module 1 havethe following effects.

(1) The existing electronic circuit such as the IC chip 63 and interfacecircuit 64 and the IC chip 30 in the IC module 1 are electricallyconnected to each other by forming the hole portion 71 on the IC memorycard 140, providing the conductive pattern portions 81 to 86 extendedfrom the conductive pattern on the printed circuit board 62, andpermitting the conducive pattern portions 81 to 86 to contact thecontact terminals 111 to 116 of the IC module 1. Accordingly, the ICmodule 1 can be connected to the IC memory card 140 having the existingelectronic circuit such as the IC memory chip 63 and the interfacecircuit 64 so that the IC memory card 140 can be operated also as the ICcard.

(2) It is possible to use the IC module 1 for a plurality of IC memorycards like the contactless IC card 120 by replacing it with another.Further, since the thickness of the IC module 1 can be made the same asthe maximum thickness of the card substrate 40 which is allowable by thestandard, strength of the IC module 1 can be improved.

(3) Still further, when the IC memory card 140 and IC module 1 areelectrically connected to each other using the anisotropic conductivefilm 200 of FIG. 6, data transfer can be assured and adhesion betweenthe contactless IC card 120 and IC module 1 can be improved.

A perspective view of an IC coin to which the IC module 1 can be appliedis shown in FIG. 12.

An IC coin 160 consists of a discoid substrate 90 having a hole portion91 in which the IC module 1 of FIG. 1 is engaged. A concave portion 92and a convex portion 93 are formed on inner side surfaces of the holeportion 91 so as to correspond to the convex portion 14 and concaveportion 15 of the IC module 1 of FIG. 1. In such IC coin 160, functionsand effects, which are substantially the same as those of theaforementioned various data carriers, can be obtained by engaging the ICmodule 1 of FIG. 1 in the hole portion 91.

Another embodiment of a conductive pattern provided on the hole portion41 of the data carrier such as the contactless IC card is shown in FIG.13. As a conductive pattern provided on the hole portion 41 of the datacarrier such as the contactless IC card, a projecting conductiveterminal 500 having an acute angle at its tip end is fixed on the holeportion 41 so as to project toward the inner surface of the cardsubstrate 40. The projecting conductive terminal 500 is urged toward theconfronted inner surface of the card substrate 40 by urging means 501such as a conductive spring which is electrically connected to anelectronic circuit inside the card substrate 40. With such anarrangement, when the IC module 1 is engaged in the hole portion 41 ofthe data carrier, the side surface contact terminal (e.g., 115) of theIC module 1 electrically contacts the projecting conductive terminal 500with assurance without using the anisotropic conductive film 200 of FIG.6. Since the projecting conductive terminal 500 is movable by the urgingmeans when the IC module 1 is engaged in the hole portion 41, a part ofthe projecting conductive terminal 500 projecting from the inner sidesurface of the hole portion 41 does not obstruct the engagement of theIC module 1 in the hole portion 41. At this time, if a concave portion510 is provided on the side surface contact terminal 115 of the ICmodule 1 at the portion where the side surface contact terminal 115contacts the projecting conductive terminal 500 of the data carrier sothat the tip end of the projecting conductive terminal 500 can beengaged in the concave portion 510, the IC module 1 is supported by theprojecting conductive terminal 500 when the IC module 1 is engaged withthe data carrier, which results in the improvement of fitting of the ICmodule 1 on the data carrier. Further, since an electric contact areabetween the projecting conductive terminal 500 and the side surfacecontact terminal 115 of the IC module 1 is increased by providing aconductive material inside the concave portion 510 like the side surfacecontact terminal 115, the IC module 1 can be electrically connected tothe card substrate 40 with more assurance.

The present invention is not limited to the aforementioned embodimentsbut can be varied variously. For example, the IC module shown in FIG. 1can be applied to various data carriers such as an IC tag and an IC keywhich are not shaped like a card. Further, the IC module 1 shown in FIG.1 may be formed of another shape such as a discoid one. In such a case,a hole portion of the IC card may be varied corresponding to the shapeof the IC module 1. Still further, an internal structure of the ICmodule 1 shown in FIG. 1 may be changed to a structure other than thatof FIG. 2. Still further, an internal structure of the IC chip 30 in theIC module 1 may be changed to a structure other than that of FIG. 3.

When the IC module 1 is removed from the various data carriers, it canbe easily pushed from the rear surface of the substrate if the holeportion of he data carrier is a through hole portion. If the holeportion is not the through hole portion, the IC module 1 can be easilyremoved by providing a claw portion for removal purpose on the uppersurface of the IC module 1.

If the IC module is not fitted on the data carrier, a cover forprotecting the hole portion of the data carrier or a dummy IC module maybe fitted on the data carrier.

INDUSTRIAL UTILIZATION

As described in detail above, since the IC module according to thepresent invention comprises an IC chip provided inside the block-shapedinsulator, a plurality of contact terminals which are provided on theupper and side surfaces of the insulator and are electrically connectedto the IC chip, and retaining means provided on the side surfaces of theinsulator, if the member on which the IC module is fitted is engagedwith the IC module by the retaining means, the IC module can beelectrically connected to the member on which the IC module is fitted byway of the contact terminals. Accordingly, the IC module can be fittedon various data carriers such as the IC card with contacts having noexisting electronic circuit, contactless IC card having an existingelectronic circuit, and the IC memory.

Further, since the IC module is structured to be engaged with the memberon which the IC module is fitted, it does not form a dedicated part of apiece of specific card but can be used for other data carriers by beingreplaced. Still further, since the IC module is structured to be engagedwith the member on which the IC module is fitted, the thickness of theIC module can be made the same at maximum as that of the member on whichthe IC module is fitted, so that the IC module can be improved in itsstrength.

Still further, since the data carrier serving as the member on which theIC module is fitted is structured to have a hole portion in which the ICmodule is engaged, the IC module can be simply and surely engaged in thehole portion by the retaining means and holding means. Still morefurther, the IC module of the present invention can be applied to thedata carrier having the existing electronic circuit by providing theconductive pattern, which is electrically connected to the existingelectronic circuit, on the inner side surfaces of the hole portion.

I claim:
 1. An IC module mounted to a data carrier for sending andreceiving data between the IC module and the data carrier,wherein the ICmodule comprises:(a) an IC chip including a data processor comprising acentral processing unit and a terminal through which data is sent to andreceived from said data processor, (b) an insulator for carrying said ICchip and having a given block-shape, (c) contact terminals which extendfrom an upper surface of said insulator to particular side surfaces ofsaid insulator and which are electrically connected to said terminal ofsaid IC chip, and (d) retaining means which are formed on side surfacesof said insulator other than said particular side surfaces fordetachably engaging the IC module with said data carrier; and said datacarrier comprising:(a) a substrate formed of an insulating member havinga thickness which corresponds to that of said IC module and surfacedimensions greater than that of said IC module, (b) a hole portionprovided on said substrate and sized so that said IC module can beaccommodated in said hole portion, (c) data processing means arranged insaid substrate for sending data to and receiving data from an externaldevice, and (d) internal terminals provided on inner peripheral surfacesof said hole portion and electrically connected to said data processingmeans so as to transfer said data between said internal terminals andsaid data processing means; and a conductive member interposed betweensaid IC module and said data carrier for electrically connecting saidcontact terminals of said IC module to said internal terminals of saiddata carrier when said IC module is engaged in said hole portion of saiddata carrier.
 2. The IC module according to claim 1, wherein saidconductive member is an annular and elastic anisotropic conductor. 3.The IC module according to claim 2, wherein said conductive member hashole portions at positions corresponding to said retaining means of saidIC module.
 4. An IC module mounted to a data carrier for sending dataand receiving data,wherein the data carrier comprises an electricalcircuit; and wherein the IC module comprises:an IC chip having anarithmetic portion and a program memory, wherein the arithmetic portionperforms an arithmetic operation in accordance with a program stored inthe program memory; a plurality of contact terminals formed on the ICmodule and electrically connected to the IC chip, including a firstcontact terminal formed on the IC module for sending data to andreceiving data from an external device, and a second contact terminalformed on the IC module for coupling the IC module to said electricalcircuit arranged in the data carrier; and a retaining member formed onthe IC module for removably attaching the IC module to the data carrier.5. An IC module mounted to a data carrier for sending data and receivingdata,wherein the data carrier comprises an electrical circuit, andwherein the IC module comprises:a first contact terminal formed on theIC module for sending to and receiving Read/Write control informationfrom an external device; and a second contact terminal formed on the ICmodule for coupling the IC module to said electrical circuit arranged inthe data carrier.
 6. A data carrier according to claim 5, wherein theelectrical circuit on the data carrier comprises an interface IC and acoil.
 7. A combination of an IC module mounted to a data carrier forsending data and receiving data between the IC module and a dataprocessing circuit in the data carrier,wherein the IC modulecomprises:(a) an IC chip, and (b) contact terminals formed on the ICmodule and electrically connected to the IC chip; wherein the datacarrier comprises:(a) a substrate having a hollow portion foraccommodating the IC module therein, (b) the data processing circuitarranged in the substrate, and (c) internal terminals formed on an innerperiphery of the hollow portion of the substrate and electricallycoupled to the data processing circuit; and a conductive memberinterposed between the IC module and the data carrier for electricallycoupling the contact terminals of the IC module to the internalterminals of the data carrier when the IC module is accommodated in thehollow portion of the data carrier.
 8. An IC module mounted on a datacarrier according to claim 7, wherein the conductive member is anannular and elastic anisotropic conductor.
 9. An IC module mounted on adata carrier according to claim 8, further comprising:a retainingelement provided on the IC module; a holder element provided on theinner periphery of the hollow portion of the data carrier positioned soas to hold the retaining element of the IC module; and hole portions inthe conductive member at positions corresponding to a position of theretaining element of the IC module.
 10. A method for mounting an ICmodule to a data carrier, for sending and receiving data between the ICmodule and the data carrier, comprising the steps of:forming the ICmodule by:(a) providing an IC chip including a data processor comprisinga central processing unit and a terminal through which data is sent toand received from said data processor, (b) placing said IC chip on aninsulator having a given block-shape, (c) providing contact terminalswhich extend from an upper surface of said insulator to particular sidesurfaces of said insulator and electrically connecting said contactterminals to said terminal of said IC chip, and (d) forming retainingmeans on side surfaces of said insulator other than said particular sidesurfaces for detachably engaging the IC module with said data carrier;and forming said data carrier by:(a) forming a substrate from aninsulating member having a thickness which corresponds to that of saidIC module and surface dimensions greater than that of said IC module,(b) providing a hole portion on said substrate sized so that said ICmodule can be accommodated in said hole portion, (c) arranging dataprocessing means in said substrate for sending data to and receivingdata from an external device, and (d) providing internal terminals oninner peripheral surfaces of said hole portion and electricallyconnecting said internal terminals to said data processing means so asto transfer said data between said internal terminals and said dataprocessing means; and interposing a conductive member between said ICmodule and said data carrier for electrically connecting said contactterminals of said IC module to said internal terminals of said datacarrier when said IC module is engaged in said hole portion of said datacarrier.
 11. The method for mounting an IC module to a data carrieraccording to claim 10, wherein said conductive member is an annular andelastic anisotropic conductor.
 12. The method for mounting an IC moduleto a data carrier according to claim 11, wherein said conductive memberhas hole portions at positions corresponding to said retaining means ofsaid IC module.